What are the main applications of DMP-30?

DMP-30 is the abbreviation of 2,4,6-tris(dimethylaminomethyl)phenol. As a curing catalyst for thermosetting epoxy resin adhesives, it can greatly increase the reaction speed between the curing agent and the epoxy resin and reduce the curing temperature. It does not affect the physical and chemical properties of the adhesive; compared with other curing agents, it has good catalytic effect and complete reaction, and is generally suitable for low-temperature, high-temperature resistance and low-molecular-weight rubber-modified epoxy adhesives and some special purposes and special applications. Craft adhesive. DMP-30 can also be used as a catalyst for isocyanate trimerization reaction, making the reaction proceed quickly, reaching the highest reaction temperature in a short time, and producing a final product with better performance. This catalyst forms a co-oxidant with the epoxy compound and is used for The trimerization reaction of isocyanate has good compatibility with isocyanate, low toxicity, stable storage, and low price. It has great development prospects to replace some more expensive catalysts to prepare high-resilience polyurethane products.

DMP 30 is mainly used as an epoxy resin curing agent. It can be quickly cured at room temperature or low-temperature cured epoxy resin coating, and can be used for castings, seals, etc. DMP 30 can be used as an epoxy resin curing agent alone. For bisphenol A epoxy resin with an epoxy equivalent of 185 to 195, the dosage is 10%. It can also be mixed with other epoxy curing agents to promote curing and can improve The curing rate, when used as an accelerator, is 0.1% to 3%; when used in epoxy resin liquid polysulfide systems, the normal temperature curing dosage is 10% to 15%, and the heating curing dosage is 6%. Generally speaking, DMP 30 can be used alone to impart unique properties to the bonding system and sealing materials. When used as an accelerator, it can greatly reduce the curing temperature and improve the curing efficiency. It has a wide range of uses in the field of epoxy resin adhesives. The ring-opening mechanism of the cured epoxy group is as follows: First, the N atom in DMP 30 contains a lone pair of electrons, and the nucleophilicity of its lone pair of electrons promotes the attack on the epoxy group. After the epoxy group is opened, The formed oxygen anions can further react with epoxy groups to achieve polymerization and curing of epoxy resin. See the following reaction process:

If there is research and development of an epoxy self-leveling epoxy resin curing agent, it is composed of 45 to 55 parts by weight of raw materials polyetheramine (D-230), 20 to 24 parts of nonylphenol, 1 to 9 parts of DMP-300, and ring Prepare by reacting 1 to 6 parts of oxy resin, 1 to 4 parts of benzyl alcohol, and 1 to 7 parts of 2168 curing agent. Add nonylphenol, epoxy resin, and benzyl alcohol to the reactor, stir evenly and set aside; then react in another Add D-230 and DMP-30 into the reactor and heat it to 60°C; then the flow from the front reactor is added dropwise to the rear reactor for reaction, and the dripping speed is controlled to maintain the reaction temperature at 60~70°C within 1~2h. The dropwise addition is completed; continue to react at 60~70°C for 1 hour, then cool down and discharge. It has light color, high gloss and low viscosity, and is particularly suitable as a curing agent for epoxy floor topcoats.

There is also research and development of an epoxy resin photoelastic model, which uses four raw materials: 618# epoxy resin, methylhexahydrophthalic anhydride, accelerator DMP-30, and epoxy resin defoaming agent to prepare a mixed liquid; when preparing the mixed liquid, Pour the weighed methylhexahydrophthalic anhydride and epoxy resin defoaming agent into the epoxy resin and start stirring. During the stirring process, use a rubber dropper to drop the weighed DMP-30 into the mixture drop by drop; Pour the mixed liquid into the mold; after the pouring is completed, put the mold into the oven and heat it to solidify the mixed liquid; after the heating process is completed, take the mold out of the oven and remove the mold to get the formed model; place the formed model Put it into the oven for quenching to obtain the epoxy resin photoelastic model. The reaction process of the mixed liquid prepared by this formula is not violent, the curing time is short, the curing process is simple, the fading effect is good after the model is formed, the internal residual stress is small, the chemical raw materials used have low toxicity, no irritating smell, and almost no harm to the body .

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